مقایسه آزمایشگاهی میزان اثربخشی عصاره حنا، هیپوکلرید سدیم و نیستاتین در کنترل پلاک کاندیدا یی موجود بر روی قطعات رزین آکریل آلوده

Introduction: Denture stomatitis is known as common complications in denture users, caused by adherence and colonization of Candida albicans on denture surfaces. Decontamination of dental prostheses using common chemical disinfectants brings about allergic disorders. The aim of this study was to compare the effectiveness of Lawsonia inermis extracts and Sodium hypochlorite for disinfection of resin acryl plaques, which experimentally contaminated with C. albican. Methods: In present experimental study 100 square shape, 10×10×1 mm acrylic resin plates were inoculated in C. albicans suspension. The average number of Candida cells which adhered to 12 randomly selected acryl resin plates was firstly determined and 88 remaining plates were divided in 4 groups that were immersed for 8 hours in 500mg/100cc lawsonia inermis extracts 2% Sodium Hypochlorite as test groups, and 100000 IU Nystatin and distilled water as positive and negative control groups respectively. The Candida removing ability of 2 disinfectants and the control groups was assessed by comparing the number of colony forming units per 1 ml of the plates washing solution cultivated on Sabouraud dextrose agar plates before and after the removing protocol. Data was analyzed using Kruskal-Wallis and Mann-Whitney tests. Results: There was seen a statistically significant differences in average viable C. albicans cells isolated from acryl resin plates before and after disinfection with lawsonia inermis extract, Sodium hypochlorite and Nystatin (P=0.0001). Sodium hypochlorite reduced 100% of attached Candida on the rein acryl plates Lawsonia inermis extract more than 80% and only less than 25% by distilled water. Conclusions: According to present results, it seems that lawsonia inermis extracts, which is inexpensive and without any side effects, it can be suggested for controlling of Candida biofilm and prevention of denture stomatitis.